Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Efficient mixing and pumping of liquids at the microscale is a technology that is still to be optimized. The combination of an AC electric field with a small temperature gradient leads to a strong electrothermal flow that can be used for multiple purposes. Combining simulations and ... Mehr lesen
In the rapid development cycle of sensor systems, minimizing time-to-market is crucial. However, designing a new MEMS-chip (Micro-Electro-Mechanical Systems) presents significant challenges due to the extensive time required for manufacturing and characterization. This delay affects the ... Mehr lesen
Quasi-static 2D-MEMS vector scanners are micro-opto-electro-mechanical systems (MOEMS) made of monocrystalline silicon. The primary application for these controllable micromirrors is the high dynamic and precise deflection of laser beams, for example in light detection and ranging ... Mehr lesen
In order to facilitate semiconductor production in the upcoming technology nodes (3nm, 2nm, 14A) our state-of-the-art multi beam mask writer (MBMW) needs constant improvement in throughput and writing precision. As these two goals contradict each other, adaption of the electron optical ... Mehr lesen
The goal of this study is to exploit the phase change in vanadium dioxide (VO₂) for optical sensing. Infrared (IR) sensing is of paramount interest for next-generation Internet of Things (IoT) devices. Phase change materials (PCMs) are expected to enable low-energy consumption sensors, ... Mehr lesen
光纤拉锥技术是一种广泛应用的光纤后处理手段，通过对光纤形状和光学性能的调整，可以制造各种光纤器件，进而拓展光纤在传感、通信和非线性光学等领域的应用。拉锥过程中，需将光纤加热至二氧化硅的玻璃化转变温度以上，使其由玻璃态转变为粘流态，并通过在加热区施加拉力实现光纤的形变。有效控制该过程中的温度场和力学应力场对实现高精度光纤拉锥至关重要。 本研究利用COMSOL Multiphysics的多物理场耦合能力，构建了一个综合考虑固体传热、层流和动网格的光纤拉锥仿真模型。通过模拟光纤在高温区的受热过程及粘流态下的变形行为，该模型能够真实再现拉锥过程中热源 ... Mehr lesen
Resistive random access Memory (RRAM) is a non-volatile memory that operates by switching resistance between the formation (ON) and the rupture (OFF) of the conductive filaments (CF), representing the binary states of logic "0" and "1". RRAM is considered one of the most promising ... Mehr lesen
Photonic integrated circuits (PIC) play important roles in contemporary optical communication systems. Incorporating functional materials into PICs equips passive photonic devices with active modulation capabilities, unleashing great potentials in optical signal processing, quantum ... Mehr lesen
Wafer bonding technology has become a crucial process in 3D IC integration, particularly as a key method for monolithic integration where Through-Silicon Via (TSV) technology is not used [1]. However, due to the intricate mechanical stress and interconnect reliability issues associated ... Mehr lesen
超导转变边沿探测器（Transition edge sensor，TES）利用超导薄膜电阻对温度的高灵敏响应关系来精确测量光子能量。在TES探测器设计开发中，当前主要采用小信号原理，通过线性近似方式来建立探测器输出脉冲与各参数之间的关系，该方法无法分析探测器尺寸效应、信号饱和等情况，且无法处理更加复杂的结构，这限制了TES探测器技术的发展。 在本研究中利用COMSOL Mutiphysics®软件进行TES吸收体与超导薄膜传热分布，与电信号反馈的仿真。首先，利用COMSOL固体传热模块进行对TES器件进行传热物理场的建模。然后利用AC ... Mehr lesen