Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
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Sehen Sie sich die Kollektion für die COMSOL Conference 2023 an
A tablet blister cavity is thermally modelled using the Shell interface in COMSOL® and a response surface created to connect to other simulations such as process flow/cost models to form a surrogate model. This virtually represents a pharmaceutical tablet packaging line, that is ... Mehr lesen
In this paper, the COMSOL Certified Consultant BE CAE & Test shows as the general extrusion operators can be successfully used to simulate thermal transfers in an industrial rotating furnace. Heat transfer in translating and rotating furnaces is a topic of high interest in several ... Mehr lesen
Topology optimization of conjugate heat transfer problems is an relatively intricate problem due to the coupled nature of Navier-Stokes equation, continuity equation and energy equation. In any density based topology optimization code, the major parts are finite element analysis, ... Mehr lesen
Droplets and their interaction with solid substrates are ubiquitous in nature. Such interactions also have commercial significance, as they are observed in many important applications. Impingement dynamics of aqueous droplets with solid substrates are largely understood due to extensive ... Mehr lesen
Today’s manufacturing industries like automobile, aerospace and Machine tools are demanding more accurate machined parts. Machine tool center has 40-70% of Machining error due to thermal issues. Temperature rise creates non-linear thermal deformation of machine. Significant cause of ... Mehr lesen
Smart materials, due to their ability to undergo structural and functional changes in response to external stimuli have garnered significant attention in different applications. Among these, metal hydrides have been extensively studied as potential candidates for hydrogen storage. ... Mehr lesen
Optimization of the shape of material for improving the power output of thermomagnetic oscillator Shivam Shukla a and Deepak K a,* a Department of Metallurgical Engineering, Indian Institute of Technology (BHU), Varanasi – 221005 *Corresponding author : deepak.met@iitbhu.ac.in Abstract ... Mehr lesen
This study presents simulation findings from a 4-way link box assembly, aimed at understanding temperature-related challenges. The primary objective was to assess maximum temperatures within the assembly, focusing on the Complete Assembly, UET, Copper Busbar, and Wedge Link Busbar. ... Mehr lesen
Laser surface texturing has emerged as a promising texturing technique due to properties such as excellent repeatability, non-contact process, the ability to achieve small-size features and high-quality finishing. The work described here is part of the H2020 research program called SHARK ... Mehr lesen
This work describes the implementation with COMSOL Multiphysics® of a thermal simulation of a space environmental chamber, the SpaceQ chamber [1]. Space environment facilities are needed to simulate on Earth the expected performance of hardware and instrumentation that shall operate in ... Mehr lesen