Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits
Veröffentlicht in 2014
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections.
To illustrate those eventual problems, we designed simulated studies with the COMSOL Multiphysics® tools, using industrial cases from ST Microelectronics molding process and integrated circuits. This paper describes the mechanical consequences of the molding process for the packaging of integrated circuits, which are critical for their reliability.
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- semmar_poster.pdf - 0.75MB
- semmar_paper.pdf - 1.13MB
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