Quasi-static Analysis on the Effect of Metal Penetrating Depth into the Substrate in Microstriplines
Veröffentlicht in 2008
The effect of metallization thickness on planar transmission lines plays an essential role in microwave integrated circuits and thin film technology, especially in the propagation characterization and the electric field distribution in the structures.
The objective of this paper is to consider the planar transmission lines with finite thickness not penetrating and penetrating into isotropic substrate to present computer-aided analysis using finite element method (FEM) with COMSOL that allows simple and accurate computation of its design parameters. Close agreement with published results has been obtained.
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