Veröffentlichungen und Präsentationen

In this study, computational fluid dynamics analysis software (COMSOL Multiphysics) is used to predict heat transfer for the hot-pressed mold of semiconducting vacuum laminator. The predicted results are compared with the experimental measurements to verify the accuracy of simulations. The mold heated by electric pipes that were formed as concentric circle similarly and installed the mold within upper and lower symmetry. In a closed mode, the whole cavity of the mold will lie in a vacuum. Assume that the external ambient room temperature and natural convection boundaries, there are thermal contact resistance between parts.