Convective Cooling of Electronic Components
The time-dependent fluid flow and thermal interactions have been solved for transient and steady state conditions of the conjugate heat transfer problem between the natural convective flow and heat sinks composed of arrays of pins. The increased ratio of convective to conductive heat transfer across the boundary of the heat exchanger leads to improved dissipation of heat generated by the attached components. The dimensions and geometric configuration of the pins in the array can be selected to provide improved heat transfer characteristics. The response of the array can be studied by using a repeating unit cell representation of the geometry. The results indicate a limiting height of the array exists after which no further improvement in performance may be obtained.
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