Veröffentlichungen und Präsentationen

The development and analysis of interconnects in inhomogeneous structures such as very large scale integration chips, printed circuit boards, and multichip modules are essential for next-generation electronic products.

In this paper, we illustrate fast and sufficiently accurate computation of capacitance matrices of multilayered and multiconductor interconnects applying the finite element method. We specifically design three-conductor transmission lines interconnect with three dielectric layers, and twelve-conductor transmission lines interconnect with five dielectric layers. Comparison of our numerical results from COMSOL Multiphysics with published data shows good agreement.