Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. Mehr lesen
This app demonstrates: Light theme This app allows you to evaluate cross-section data for a wide range of American and European standard beams. Given a set of forces and moments acting on the section, you can also compute a detailed stress distribution. Calculated cross-section data ... Mehr lesen
This model describes the pressure wave propagation in a muffler for an internal combustion engine. The purpose of the model is to show how to analyze both inductive and resistive damping in pressure acoustics as well as coupling the fluid to the surrounding elastic shell structure of the ... Mehr lesen
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... Mehr lesen
In this example, the External Stress feature in the Solid Mechanics interface is used to provide the material model with the nonsymmetric stress required in the design of an elastic invisibility cloak. The cloak is a domain with special material properties aimed at shielding a region of ... Mehr lesen
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is a reliability test used for semiconductor packaging and assembly. This model demonstrates the stress analysis of an IGBT module subjected to a four ... Mehr lesen
In this example you will build and solve a 3D beam model using the 3D Beam interface. This model shows how a thermally induced deformation of a beam is modeled. Temperature differences are applied across the top and bottom surfaces as well as the left and right surfaces of the beam. ... Mehr lesen
This example studies the deformation of a hemispherical shell, where the loads cause significant geometric nonlinearity. The maximum deflections are more than two magnitudes larger than the thickness of the shell. The problem is a standard benchmark, used for testing shell formulations ... Mehr lesen
Various boundary conditions are employed in the computation of homogenized properties for heterogeneous materials. The choice between periodic or homogeneous boundary conditions depends on whether the infinitesimal volume is modeled as a repeating unit cell (RUC) or a representative ... Mehr lesen