Electrodeposition of a Microconnector Bump with Deforming Geometry in 3D

Application ID: 16967


This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer expression.

The model is an extension to 3D of the Electrodeposition of a Microconnector Bump in 2D example.

Dieses Beispiel veranschaulicht Anwendungen diesen Typs, die mit den folgenden Produkten erstellt wurden: