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Note: This discussion is about an older version of the COMSOL Multiphysics® software. The information provided may be out of date.

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Using the assembly form

Posted 06.05.2013, 09:28 GMT-4 MEMS & Nanotechnology, MEMS & Piezoelectric Devices, Structural Mechanics Version 4.3 0 Replies

Javier Martin
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Hello,


I am trying to simulate with "piezolectric devices". Specifically, I would like to exert stress on a thin film in contact with a piezoelectric 3D block. The geometry is quite simple but in order to mesh the thin film using "swept" I have to use "assembly" finish form (if I am right).

The problem is that during the simulation, it seems that both 3D piezoelectric block and thin film does not interact in any way (i.e. stress is not exerted).

I have played with "contact pairs" and "indetity pairs" with no success ! I am getting desesperate.

Any suggestion ?


Thanks !

Javier.
0 Replies Last Post 06.05.2013, 09:28 GMT-4
COMSOL Moderator

Hello Javier Martin

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