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Strange Probem of Thermal Stress Simulation Results in 4.3, may be a bug.
Posted 08.06.2013, 04:43 GMT-4 MEMS & Nanotechnology, Heat Transfer & Phase Change, MEMS & Piezoelectric Devices, Results & Visualization, Structural Mechanics Version 4.3 0 Replies
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I am facing with a quite strange problem in the simulation of thermal stress. It is an semiconductor device's coupled electro-thermal-stress simulation. The heat is generated by the physics of Electrostatics and Transport of Diluted Species, and then use the Thermal Stress to calculate the temperature and stress profile. However, the simulation results is so strange that there is bizarre maximum-value area in the results of temperature and stress. Please see the attached pictures. Additionally, if I use the Heat Transfer in Solids to solve, there's no problem in the results of temperature. I'm not sure whether it's a bug of Thermal Stress or not. I'm stuck in this problem quite a long time and anxious about this. Thanks a lot!
Hello Weifeng Zhou
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