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Issues about settlement of condition-The temperature change input of an isothermal body
Posted 25.02.2022, 11:18 GMT-5 Heat Transfer Version 5.6 2 Replies
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Hello. My simulation is for a packaged electronic component (3D), the main structure of which is the chip, the pin and the package structure. I would like to simulate** the temperature of the package structure and the pins as a function of the chip temperature**. The chip is assumed to be isothermal. The problem encountered is that the chip is a 3D isothermal body and it is not possible to impose changing temperature conditions through the temperature boundary (face boundary). Here I would like to inquire on setting up the multi-physics field conditions.
looking forward to replys.
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Zhongchao,
I would think that this task should be an easy one, but it is not really clear to me what the problem is.
Cheers Edgar
-------------------Edgar J. Kaiser
emPhys Physical Technology
www.emphys.com
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I have fixed this problem.
Thanks for COMSOL Technical Support's help and here attached the solution:
If I understand correctly, you would like to assign the temperature to a whole domain? If this is the case, I believe that such a domain does not need to be included in the simulation, only its boundaries connecting to other domains. Those boundaries can be assigned a temperature thanks to a Temperature boundary condition.
Also thanks for Edgar J. Kaiser's reply.