Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Thermal simulation of packaged circuite
Posted 08.11.2017, 10:21 GMT-5 Ray Optics, Heat Transfer & Phase Change, Heat Transfer Version 5.2 0 Replies
Please login with a confirmed email address before reporting spam
I need to simulate a packaged optical+electrical circuite which is in a box (filled with N). We want to see the effect of enviromental tempreture change (out of the box) in steady status responce of inner parts. can anyone please let me know how I should define these boundry conditions in heat transfer model ? how should i model the convection of N in the box ? Thank you
Hello Maziyar Milanizadeh
Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.
If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.