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In collaboration with STMicroelectronics, UNIFI employed advanced multiphysics simulations to optimize the electroplating processes used in chip manufacturing. This project focused on enhancing the uniformity and quality of copper layers deposited on microchips, which are integral components in various electronic devices.

Electroplating involves several complex phenomena, including fluid dynamics, electrochemistry, and heat transfer. Traditional methods of process optimization, relying on physical prototypes, are time-consuming and costly. By leveraging COMSOL Multiphysics® software, we created high thoughtput virtual prototypes to simulate these processes under various conditions.

Key parameters such as current density, electrolyte flow, and bath geometry were initially analyzed to identify optimal set of variable that ensure an efficient simulation of copper deposition on a three leadframes design hosting 1350 chips. We found that simulations under primary current distribution allowed for rapid testing of different setups, minimizing the need for extensive physical experimentation. This not only reduced development costs but also accelerated the time-to-market for new chip designs.

Results from the simulations were validated against experimental data, showing a strong comparison between predicted and actual deposition thicknesses. The findings highlighted the critical role of adjustable shielding and precise control of electrolyte flow in achieving uniform copper layers across all chips in a batch.

This study demonstrates the effectiveness of multiphysics simulations in streamlining the electroplating process, paving the way for more efficient and cost-effective chip production methods. The collaboration with STMicroelectronics exemplifies how industry partnerships can drive innovation through advanced computational techniques.