Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This example presents transient analysis of the wave propagation in rock mass caused by a short duration load on the surface. Such loads are typical during tunnel constructions and other excavations using blasting. The example shows the use of the Low-reflecting boundary conditions to ... Mehr lesen
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. Mehr lesen
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... Mehr lesen
This model calculates the eigenfrequencies and mode shapes of an unconstrained cylinder in axisymmetry. The model is taken from NAFEMS Free Vibration Benchmarks. The eigenfrequencies are compared with the values given in the benchmark report. Three different physics interfaces are ... Mehr lesen
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... Mehr lesen
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Mehr lesen
In this example, the homogenized elastic and viscoelastic properties of a particulate composite are computed based on the individual properties of elastic particles embedded in a viscoelastic matrix. Periodic boundary conditions are applied to a unit cell of the particulate composite ... Mehr lesen
In this tutorial model, the flow in a pipe with a bend is computed using the Pipe Flow interface. The computed fluid load is used as input to a stress analysis in the Pipe Mechanics interface. Gravity loads from the pipe and fluid are also taken into account. Mehr lesen
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... Mehr lesen
In this benchmark example, a semi-elliptical crack at the inner surface of a cylinder is studied. The inside of the cylinder and the crack faces are subjected to a pressure load. The J-integral is calculated along the crack front, and the stress intensity factor is then compared with the ... Mehr lesen