Note: This discussion is about an older version of the COMSOL Multiphysics® software. The information provided may be out of date.
Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Simulation of Self folding due to Surface Tension of Solder
Posted 29.04.2014, 16:17 GMT-4 Version 4.3b 0 Replies
Please login with a confirmed email address before reporting spam
I am trying to simulate a self assembly process where I have two frames of Nickel joined together by a solder hinge. When this solder melts, due to surface tension forces, the Ni arms lift up. How do I start with this and if anyone has a similar model, could you please share it with me. I would like to know what physicas to use and whether simulationg in 3D will be easy or tough?
Hello Avishek Mishra
Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.
If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.