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Posted:
1 year ago
11.07.2023, 21:26 GMT-4
If there are no losses in the problem the eigenvalue solver usually comes up with very small imaginary parts for the eigenfrequencies. When a loss mechanism is present (fluid damping or friction or whatever) the imaginary part represents an actual physical loss leading to a finite quality factor.
If there are no losses in the problem the eigenvalue solver usually comes up with very small imaginary parts for the eigenfrequencies. When a loss mechanism is present (fluid damping or friction or whatever) the imaginary part represents an actual physical loss leading to a finite quality factor.
Henrik Sönnerlind
COMSOL Employee
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Posted:
1 year ago
12.07.2023, 02:34 GMT-4
You should only solve for structural mechanics in the eigenfrequency study. If not, you will see the very small imaginary eigenvalues of the diffusion type equations, like thermal eigenmodes.
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Henrik Sönnerlind
COMSOL
You should only solve for structural mechanics in the eigenfrequency study. If not, you will see the very small imaginary eigenvalues of the diffusion type equations, like thermal eigenmodes.
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Posted:
1 year ago
12.07.2023, 10:21 GMT-4
Updated:
1 year ago
12.07.2023, 10:26 GMT-4
You should only solve for structural mechanics in the eigenfrequency study. If not, you will see the very small imaginary eigenvalues of the diffusion type equations, like thermal eigenmodes.
If there are no losses in the problem the eigenvalue solver usually comes up with very small imaginary parts for the eigenfrequencies. When a loss mechanism is present (fluid damping or friction or whatever) the imaginary part represents an actual physical loss leading to a finite quality factor.
Thank you, Dave and Heinrik, for your insightful replies.
I wish to elaborate more on the goal of this simulation.
I have a stepped microbeam, which I am heating up by applying a voltage across it.
I want to know how the eigenmode frequencies vary as I change the voltage across the beam.
The beam is made from Silicon and is inside a vacuum. It is also anchored on both ends, and these ends act as the electrodes as well.
The only energy loss can be considered to be the heat radiating out from the beam. The vacuum is in the 10milliTorr range, so the air damping can be neglected.
How can I achieve this multiphysics simulation?
Appreciate your insight!
>You should only solve for structural mechanics in the eigenfrequency study. If not, you will see the very small imaginary eigenvalues of the diffusion type equations, like thermal eigenmodes.
>If there are no losses in the problem the eigenvalue solver usually comes up with very small imaginary parts for the eigenfrequencies. When a loss mechanism is present (fluid damping or friction or whatever) the imaginary part represents an actual physical loss leading to a finite quality factor.
Thank you, Dave and Heinrik, for your insightful replies.
I wish to elaborate more on the goal of this simulation.
I have a stepped microbeam, which I am heating up by applying a voltage across it.
I want to know how the eigenmode frequencies vary as I change the voltage across the beam.
The beam is made from Silicon and is inside a vacuum. It is also anchored on both ends, and these ends act as the electrodes as well.
The only energy loss can be considered to be the heat radiating out from the beam. The vacuum is in the 10milliTorr range, so the air damping can be neglected.
How can I achieve this multiphysics simulation?
Appreciate your insight!
Henrik Sönnerlind
COMSOL Employee
Please login with a confirmed email address before reporting spam
Posted:
1 year ago
12.07.2023, 11:24 GMT-4
There are three important contributions to the temperature dependence of the eigenfrequencies:
- The stress induced by inhibited thermal expansion
- The change in geometry due to thermal expansion
- Temperature dependence of Young's modulus
This is discussed in detail in https://www.comsol.com/blogs/how-to-analyze-eigenfrequencies-that-change-with-temperature
At microscale, you can have a significant damping contribution from thermoelastic damping. See also
https://www.comsol.com/blogs/damping-in-structural-dynamics-theory-and-sources and
https://www.comsol.com/blogs/how-to-model-different-types-of-damping-in-comsol-multiphysics
-------------------
Henrik Sönnerlind
COMSOL
There are three important contributions to the temperature dependence of the eigenfrequencies:
1. The stress induced by inhibited thermal expansion
2. The change in geometry due to thermal expansion
3. Temperature dependence of Young's modulus
This is discussed in detail in
At microscale, you can have a significant damping contribution from thermoelastic damping. See also
and