Discussion Forum

I am doing a project on Automated Tape Placement (ATP) and studying the degree of bonding and crystallization. ATP is a additive manufacturing process where thin layers are tape are placed onto a substrate. These layers tapes are fed through a spool where they are heated by a diode laser into a glassy state and then pressed by a roller onto the substrate. (For readers understanding of the process.

I have modelled the tape, roller, and substrate in COMSOL. I applied a heat flux (Heat rate) on portion of the substrate and the tape. I included thermal contact between the components as well. I have also added convective heat flux with a heat transfer coefficient of ambient air. When I plot the temperature, it shows that It is gradually increasing and not cooling at all. The roller is moving at a 300mm/s, so as the tape is placed, it should start cooling down. However, it does not do that. are there other cooling boundary conditions in COMSOL that could be helpful for this model? can the heat flux be set up in a way that it moves in the direction of the roller?